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Proceedings Paper

Inspectability of PSM masks for the 32nm node using STARlight2+
Author(s): Chain-Ting Huang; Yung-Feng Cheng; Shih-Ming Kuo; Chun-Hsien Huang; Swapnajit Chakravarty; Joe Huang; Jeff Lin; Den Wang
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Paper Abstract

Two aspects are critical when a new reticle type is introduced in a wafer fab: printability and reticle inspection. In this study, we inspected 4 PSM reticles at the 45nm technology node, at P90, on the 5xx TeraScanHR platform. We successfully inspected SL2+ reticles of the PSM type at P90. We forecast that in a high volume 32nm node production environment, P72 SL2+ will address the inspectability challenges associated with PSM masks. This is based on strict requirements for sensitivity on contamination defects, inspectability, and cost of ownership, as when UMC addressed their wafer printability issues.

Paper Details

Date Published: 19 May 2008
PDF: 8 pages
Proc. SPIE 7028, Photomask and Next-Generation Lithography Mask Technology XV, 70282P (19 May 2008); doi: 10.1117/12.793095
Show Author Affiliations
Chain-Ting Huang, United Microelectronics Corp. (Taiwan)
Yung-Feng Cheng, United Microelectronics Corp. (Taiwan)
Shih-Ming Kuo, United Microelectronics Corp. (Taiwan)
Chun-Hsien Huang, United Microelectronics Corp. (Taiwan)
Swapnajit Chakravarty, KLA-Tencor Corp. (United States)
Joe Huang, KLA-Tencor Corp. (United States)
Jeff Lin, KLA-Tencor Corp. (United States)
Den Wang, KLA-Tencor Corp. (United States)


Published in SPIE Proceedings Vol. 7028:
Photomask and Next-Generation Lithography Mask Technology XV
Toshiyuki Horiuchi, Editor(s)

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