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Proceedings Paper

Die-to-database mask inspection with variable sensitivity
Author(s): Hideo Tsuchiya; Masakazu Tokita; Takehiko Nomura; Tadao Inoue
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Paper Abstract

The cost of mask is increasing dramatically along with the continuous semiconductor scaling. ASET started a 4-year project to reduce mask manufacturing cost and TAT by optimizing Mask Data Preparation (MDP), mask writing, and mask inspection in 2006, with the support from the New Energy and Industrial Technology Development Organization (NEDO). We report on the development of a new low cost mask inspection technology with short Turn Around Time (TAT), as a result of adopting a method of selecting defect detection sensitivity level for every local area, defined by such factors as defect judgment algorithm and defect judgment threshold, as one of the pseudo-defect-reduction technique necessary to shorten mask inspection TAT. Those factors are extracted from the database of Mask Data Rank (MDR) and converted on the basis of pattern prioritization determined at device design stage, using parallel computation.

Paper Details

Date Published: 19 May 2008
PDF: 8 pages
Proc. SPIE 7028, Photomask and Next-Generation Lithography Mask Technology XV, 70282I (19 May 2008); doi: 10.1117/12.793088
Show Author Affiliations
Hideo Tsuchiya, Association of Super-Advanced Electronics Technologies (Japan)
Masakazu Tokita, Association of Super-Advanced Electronics Technologies (Japan)
Takehiko Nomura, Association of Super-Advanced Electronics Technologies (Japan)
Tadao Inoue, Association of Super-Advanced Electronics Technologies (Japan)


Published in SPIE Proceedings Vol. 7028:
Photomask and Next-Generation Lithography Mask Technology XV
Toshiyuki Horiuchi, Editor(s)

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