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Proceedings Paper

Application of two-fluid nozzles for advanced photomask cleaning process
Author(s): Kenji Masui; Tetsuo Takemoto; Kyo Otsubo; Mari Sakai; Tomotaka Higaki; Hidehiro Watanabe; Tsutomu Kikuchi; Yoshiaki Kurokawa
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Paper Abstract

Damage to minute features of 45nm-node device masks occurred during megasonic cleaning. Since we were obliged to weaken the mechanical effect of megasonics in order to prevent the collapse of minute features, we could not obtain acceptable cleaning results. In order to manage the minute features, there is a need to develop a new mechanical cleaning method that causes less damage, but does not compromise the ability to remove particles. Cleaning using a two-fluid nozzle is a promising candidate. We investigated the two-fluid nozzle and compared it with megasonic cleaning, and we confirmed that the two-fluid nozzle achieved acceptable cleaning results without damaging 45nm-node device masks. Furthermore, for 32nm-node device masks, we have improved the two-fluid nozzle in terms of the cleaning energy distribution.

Paper Details

Date Published: 19 May 2008
PDF: 9 pages
Proc. SPIE 7028, Photomask and Next-Generation Lithography Mask Technology XV, 702809 (19 May 2008); doi: 10.1117/12.793018
Show Author Affiliations
Kenji Masui, Toshiba Corp. (Japan)
Tetsuo Takemoto, Toshiba Corp. (Japan)
Kyo Otsubo, Toshiba Corp. (Japan)
Mari Sakai, Toshiba Corp. (Japan)
Tomotaka Higaki, Toshiba Corp. (Japan)
Hidehiro Watanabe, Toshiba Corp. (Japan)
Tsutomu Kikuchi, Shibaura Mechatronics Corp. (Japan)
Yoshiaki Kurokawa, Shibaura Mechatronics Corp. (Japan)

Published in SPIE Proceedings Vol. 7028:
Photomask and Next-Generation Lithography Mask Technology XV
Toshiyuki Horiuchi, Editor(s)

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