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Proceedings Paper

3D laser measurement technique of solder paste
Author(s): Bin Liu; Changku Sun; Xiaodong Zhang; Xiaobing Deng
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Paper Abstract

A 3D measurement system of solder pastes was established. The system aims to extract the height and other values of solder paste, and realize the quality control of Surface Mount Technology (SMT). 3D laser measurement technique was applied to this system. The calibration process is divided into two steps, the internal parameters of CCD camera are obtained by the RAC method of Tsai, and the laser plane parameters are calibrated with one special multi-arris block. The scanning technique fulfills the acquisition of final 3D profile. Experimental results at the product line prove that the system is a more easily operated device with high performance, and its repeatable precision reaches ±1 µm.

Paper Details

Date Published: 5 March 2008
PDF: 8 pages
Proc. SPIE 6623, International Symposium on Photoelectronic Detection and Imaging 2007: Image Processing, 662310 (5 March 2008); doi: 10.1117/12.791427
Show Author Affiliations
Bin Liu, Tianjin Univ. (China)
Changku Sun, Tianjin Univ. (China)
Xiaodong Zhang, Tianjin Univ. (China)
Xiaobing Deng, Longwei Automation Technology Ltd. (China)


Published in SPIE Proceedings Vol. 6623:
International Symposium on Photoelectronic Detection and Imaging 2007: Image Processing

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