Share Email Print
cover

Proceedings Paper

Thermal microscope imaging system for semiconductor device and IC invalidation analysis
Author(s): Meijing Gao; Weiqi Jin; Yinan Chen; Xia Wang
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

In order to analyze the invalidation of the Semiconductor Device and IC, we proposed a novel digital thermal microscope based on the uncooled focal plane detector. We give the operating principle, system's construction and the mathematical mode of noise equivalent temperature difference (NETD). Based on the mathematical model, some measures were taken to increase the system temperature resolution. Furthermore we proposed an adaptive nonuniformity correction algorithm for the UFPA. The software for the thermal microscope is provided based on Visual C++. Results of real thermal image experiments have shown that the digital thermal microscope is designed successfully and achieves good performance. Thus it will become an effective means for invalidation Analysis. This method is a novel and unique contribution to field of semiconductor device and IC invalidation analysis.

Paper Details

Date Published: 3 March 2008
PDF: 8 pages
Proc. SPIE 6621, International Symposium on Photoelectronic Detection and Imaging 2007: Photoelectronic Imaging and Detection, 662117 (3 March 2008); doi: 10.1117/12.790776
Show Author Affiliations
Meijing Gao, Beijing Institute of Technology (China)
Yanshan Univ. (China)
Weiqi Jin, Beijing Institute of Technology (China)
Yinan Chen, Beijing Institute of Technology (China)
Xia Wang, Beijing Institute of Technology (China)


Published in SPIE Proceedings Vol. 6621:
International Symposium on Photoelectronic Detection and Imaging 2007: Photoelectronic Imaging and Detection

© SPIE. Terms of Use
Back to Top