Share Email Print
cover

Proceedings Paper

Integration and characterization of spin on dielectric materials in image sensor devices
Author(s): Hai Reznik; Ruth Shima Edelstein; Michal Shach-Caplan; Fabian Dulberg; Vladimir Kamenetsky; Kimmo Karaste; Juha T. Rantala
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Continuously increasing performance requirements in CMOS image sensor based digital camera devices demand significant improvement of the optical part of the device as well as improved endurance to camera module assembly. Optical structures construction is the key element to improve the device efficiency and sensitivity. This is especially true for the small pixel size sensors used for mobile phone applications, wherein pitch size is reduced to integrate more pixels on the same area of semiconductor surface. Traditionally, the optical stack is based on organic photo-resist like materials. The introduction of inorganic Spin On Dielectric (SOD) materials opens several new options. Two novel applications of these materials are presented in this paper. In the first one, a waveguide is formed in the device backend and filled with high refractive index SOD (RI=1.652 @ 650nm) to improve optical performance. The second one employs a low refractive index SOD (RI~1.4 @650nm) topcoat, which enables easier micro lens engineering and optimization, and further offers advantage of organic micro lens mechanical protection. The two integration schemes are presented along with SOD material characteristics and processing details.

Paper Details

Date Published: 25 April 2008
PDF: 9 pages
Proc. SPIE 7001, Photonics in Multimedia II, 70010C (25 April 2008); doi: 10.1117/12.786380
Show Author Affiliations
Hai Reznik, Tower Semiconductor Ltd. (Israel)
Ruth Shima Edelstein, Tower Semiconductor Ltd. (Israel)
Michal Shach-Caplan, Tower Semiconductor Ltd. (Israel)
Fabian Dulberg, Tower Semiconductor Ltd. (Israel)
Vladimir Kamenetsky, Tower Semiconductor Ltd. (Israel)
Kimmo Karaste, Silecs Oy (Finland)
Juha T. Rantala, Silecs Oy (Finland)


Published in SPIE Proceedings Vol. 7001:
Photonics in Multimedia II
Ari Tervonen; Frank Möllmer, Editor(s)

© SPIE. Terms of Use
Back to Top