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Proceedings Paper

Challenges and innovations in very-large CCD and CMOS imagers for professional imaging
Author(s): Jan T. Bosiers; Holger Stoldt; Wilco Klaassens; Bart Dillen; Inge Peters; Erik Bogaart; Raymond Frost; Laurens Korthout; Jurgen Timpert
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Paper Abstract

This paper presents an overview of the specific challenges that need to be overcome to make very-large CCD and CMOS imagers, and presents some recent innovations in this area. The complete development chain is described: research, production and industrialization. It will be shown that by innovative design and technology concepts, high-quality very large area CCD and CMOS imagers can be made, even up to wafer size (6" for CCD, 8" for CMOS).

Paper Details

Date Published: 5 May 2008
PDF: 14 pages
Proc. SPIE 6996, Silicon Photonics and Photonic Integrated Circuits, 69960Z (5 May 2008); doi: 10.1117/12.785847
Show Author Affiliations
Jan T. Bosiers, DALSA Professional Imaging (Netherlands)
Holger Stoldt, DALSA Professional Imaging (Netherlands)
Wilco Klaassens, DALSA Professional Imaging (Netherlands)
Bart Dillen, DALSA Professional Imaging (Netherlands)
Inge Peters, DALSA Professional Imaging (Netherlands)
Erik Bogaart, DALSA Professional Imaging (Netherlands)
Raymond Frost, DALSA Semiconductor (Canada)
Laurens Korthout, DALSA Professional Imaging (Netherlands)
Jurgen Timpert, DALSA Professional Imaging (Netherlands)


Published in SPIE Proceedings Vol. 6996:
Silicon Photonics and Photonic Integrated Circuits
Giancarlo C. Righini; Seppo K. Honkanen; Lorenzo Pavesi; Laurent Vivien, Editor(s)

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