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Proceedings Paper

Research on moire fringe information extraction based on warpage measurement
Author(s): Ping Zhong; Jianxin Qiu
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Paper Abstract

Warpage measurement of PWB board and BGA package is considered as the most popular but difficult issue in microelectronic fabrication. Ordinary measuring method cannot afford the requirement of direct observation, efficiency, immediacy, high-precision as well as low cost. Moire fringe is a kind of interference pattern by which we are able to measure the flatness of surface of an object. This paper mainly concentrates on how to extract the information of effective shadow moire fringes by using digital image processing technique. It presents some algorithms applied to moire fringe image processing, such as preliminary extraction algorithm of moire fringes, intensity enhancing algorithm of fringe, fringe thinning algorithm, removal of the forficate fringe etc. In the end, the three-dimensional image from data of the two-dimensional fringe matrix has been drawn. Experiment result shows the effect of methods for extracting effective moire fringes.

Paper Details

Date Published: 27 November 2007
PDF: 5 pages
Proc. SPIE 6723, 3rd International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optical Test and Measurement Technology and Equipment, 67233X (27 November 2007); doi: 10.1117/12.783575
Show Author Affiliations
Ping Zhong, Dong Hua Univ. (China)
Jianxin Qiu, Shanghai Univ. of Engineering Science (China)


Published in SPIE Proceedings Vol. 6723:
3rd International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optical Test and Measurement Technology and Equipment
Junhua Pan; James C. Wyant; Hexin Wang, Editor(s)

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