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Proceedings Paper

Interferometric total thickness variation measurement of glass wafer
Author(s): Jae-Bong Song; Hoi-Youn Lee; Yun-Woo Lee; In-Won Lee
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Paper Abstract

Total thickness variation (TTV) is one of the important specifications of glass wafer. Glass wafers are thin and transparent parallel plates. In order to measure a flat surface by interferometer, at least one reference flat of same size is required. And the interference between two reflected wavefronts by the front and rear surfaces of the glass wafer also exists. Therefore interferometric measurements of thin glass wafers are not easy. So TTV is mainly measured not by interferometer, but by thickness gauge devices. But these devices measure only the TTV of several positions of glass wafer and don't measure the whole area. To measure the whole area or sufficient points, it requires more time. We developed a relatively simple and inexpensive interferometric TTV measurement method using Haidinger interferometer. This method can be applied to large glass wafers without large reference flat.

Paper Details

Date Published: 17 January 2008
PDF: 8 pages
Proc. SPIE 6723, 3rd International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optical Test and Measurement Technology and Equipment, 67233E (17 January 2008); doi: 10.1117/12.783503
Show Author Affiliations
Jae-Bong Song, Korea Research Institute of Standards and Science (South Korea)
Hoi-Youn Lee, Korea Research Institute of Standards and Science (South Korea)
Yun-Woo Lee, Korea Research Institute of Standards and Science (South Korea)
In-Won Lee, Korea Research Institute of Standards and Science (South Korea)


Published in SPIE Proceedings Vol. 6723:
3rd International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optical Test and Measurement Technology and Equipment
Junhua Pan; James C. Wyant; Hexin Wang, Editor(s)

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