Share Email Print
cover

Proceedings Paper

3-D topography measurement by moire stripe
Author(s): Jianxin Qiu; Liang Tan; Ping Zhong
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Using 3-D topography measurement of microelectronics Substrate as a background, the mechanism and method of accurately measured mechanical quantity through Moire stripe is studied. The paper also discusses the acquisition of Moire interference fringe image information, the analysis and process of Moire stripe image and key technological problems of how to reconstruct 3-D surface topography through Moire stripe information. This study provides non contact, high-speed and high-accuracy measurement techniques not only for microelectronics substrate but also for other information products (like shadow mask). It can be foreseen that this method has broad applications and theoretical instructions in engineering area.

Paper Details

Date Published: 27 November 2007
PDF: 7 pages
Proc. SPIE 6723, 3rd International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optical Test and Measurement Technology and Equipment, 67232F (27 November 2007); doi: 10.1117/12.783304
Show Author Affiliations
Jianxin Qiu, Shanghai Univ. of Engineering Science (China)
Liang Tan, Shanghai Jiao Tong Univ. (China)
Ping Zhong, Dong Hua Univ. (China)


Published in SPIE Proceedings Vol. 6723:
3rd International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optical Test and Measurement Technology and Equipment
Junhua Pan; James C. Wyant; Hexin Wang, Editor(s)

© SPIE. Terms of Use
Back to Top