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Proceedings Paper

Study on laser damage properties of thin films
Author(s): Jun-hong Su; Jun-qi Xu; Song-lin Xie
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Paper Abstract

Thin film plays an important part of an optical system, especially high power laser system. The anti-damage ability is an important index in evaluating their quality. Both diamond-like carbon thin film and HfO2/SiO2 thin film are good optical thin films. In this paper their laser damage properties have been tested according to ISO11254. The results of damage threshold of coatings are shown as follows: Compared to HfO2/SiO2 thin film system with a laser damage threshold of 3.0~7.4 J /cm2, the DLC film threshold is only 0.6 J/cm2, which is the result of strong absorption of DLC films to laser energy. And also we can conclude from the results that the damage of film is derived from defect-induced damage, but the damage mechanisms are different. The DLC thin film damage results from heat-stress while HfO2/SiO2 thin films' damage results from plasma ablation. Besides, the substrate of film, the films' structure and deposition methods are also important to film damage threshold. Under the same condition, the threshold of the film on Si substrate is lower than those on K9 glass; with the same substrate, the film threshold is dependent of film thickness. As for deposition methods, films deposited by using ion-assisted method have higher threshold than those without using ion-assisted method.

Paper Details

Date Published: 27 November 2007
PDF: 6 pages
Proc. SPIE 6723, 3rd International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optical Test and Measurement Technology and Equipment, 67231K (27 November 2007); doi: 10.1117/12.783185
Show Author Affiliations
Jun-hong Su, Xi'an Institute of Technology (China)
Jun-qi Xu, Xi'an Institute of Technology (China)
Song-lin Xie, Xi'an Institute of Technology (China)


Published in SPIE Proceedings Vol. 6723:
3rd International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optical Test and Measurement Technology and Equipment
Junhua Pan; James C. Wyant; Hexin Wang, Editor(s)

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