Share Email Print
cover

Proceedings Paper

Residual stresses around femtosecond laser ablated grooves in silicon wafer evaluated by nanoindentation
Author(s): Yongzhi Cao; Yanshen Wang; Shen Dong; Yanqiang Yang; Yingchun Liang; Tao Sun
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

As an excellent micromachining method, femtosecond laser ablation is more and more frequently used in micromachining. Femtosecond laser ablation can take residual stresses beside the machining area, which may affect the performance of micro devices. In this paper, grooves were ablated by femtosecond laser and nanoindentation experiments were exploited to uncover residual stresses in the area beside the grooves. The reduced modulus and hardness in different areas around the groove were measured through nanoindention and position dependent regular changes in reduced modulus were found. Such changes contained the information of residual stresses in such area. A formula correlating residual stresses with the reduced modulus was set up.

Paper Details

Date Published: 21 November 2007
PDF: 6 pages
Proc. SPIE 6724, 3rd International Symposium on Advanced Optical Manufacturing and Testing Technologies: Design, Manufacturing, and Testing of Micro- and Nano-Optical Devices and Systems, 672417 (21 November 2007); doi: 10.1117/12.782835
Show Author Affiliations
Yongzhi Cao, Harbin Institute of Technology (China)
Yanshen Wang, Harbin Institute of Technology (China)
Shen Dong, Harbin Institute of Technology (China)
Yanqiang Yang, Harbin Institute of Technology (China)
Yingchun Liang, Harbin Institute of Technology (China)
Tao Sun, Harbin Institute of Technology (China)


Published in SPIE Proceedings Vol. 6724:
3rd International Symposium on Advanced Optical Manufacturing and Testing Technologies: Design, Manufacturing, and Testing of Micro- and Nano-Optical Devices and Systems
Sen Han; Tingwen Xing; Yanqiu Li; Zheng Cui, Editor(s)

© SPIE. Terms of Use
Back to Top