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Proceedings Paper

Simulation for effect of process parameters on surface profile in thick film photolithography
Author(s): Xionggui Tang; Heping Li; Jingkun Liao; Yongzhi Liu; Yongkang Guo
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Paper Abstract

The microstructure with high fidelity is very important while being used as micro-optical component, because the performance tightly depends on the profile quality of microstructure. Optical lithography method based on thick film resist plays an increasing important role in fabrication for microstructure. However, the profile quality of the microstructure is greatly affected by process parameters adopted in the experiment. In this paper, the effect of illumination wavelength, gap distance and absorption coefficient on the profile quality after development has been simulated, analyzed and discussed in detail, by using the model for thick film lithography. The simulated results show that these process parameters have a great impact on the profile quality of microstructures, which it is helpful for process optimization and profile control of thick film photolithography.

Paper Details

Date Published: 19 November 2007
PDF: 7 pages
Proc. SPIE 6724, 3rd International Symposium on Advanced Optical Manufacturing and Testing Technologies: Design, Manufacturing, and Testing of Micro- and Nano-Optical Devices and Systems, 67240T (19 November 2007); doi: 10.1117/12.782692
Show Author Affiliations
Xionggui Tang, Univ. of Electronic Science and Technology of China (China)
Heping Li, Univ. of Electronic Science and Technology of China (China)
Jingkun Liao, Univ. of Electronic Science and Technology of China (China)
Yongzhi Liu, Univ. of Electronic Science and Technology of China (China)
Yongkang Guo, Sichuan Univ. (China)


Published in SPIE Proceedings Vol. 6724:
3rd International Symposium on Advanced Optical Manufacturing and Testing Technologies: Design, Manufacturing, and Testing of Micro- and Nano-Optical Devices and Systems
Sen Han; Tingwen Xing; Yanqiu Li; Zheng Cui, Editor(s)

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