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Proceedings Paper

Microscopic interferometry for dimensional characterization of MEMS devices
Author(s): Tong Guo; Jin-Ping Chen; Xing Fu; Xiao-tang Hu
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Paper Abstract

Microscopic interferometry for dimensional characterization and device inspection is described in this paper. This method is characteristic of fast speed, non-destructive, non-contact, and easy to be carried out at wafer scale with submicrometer lateral resolution and nanoscale vertical resolution. The measurement system is based on a Mirau microscopic interferometric objective with a piezo objective nano-positioner to realize accurate phase shifting and scanning in vertical direction in the range of one hundred micrometers. The method consists of phase shifting interferometry (PSI) and vertical scanning interferometry (VSI), the former can measure smooth surface with high accuracy and the latter can measure samples with large step variations. The measurement accuracy of the system is calibrated by a step height standard certificated by NIST. Two MEMS devices are employed to illustrate the capability of the system which is regarded as as a measurement and process characterization tool.

Paper Details

Date Published: 19 November 2007
PDF: 6 pages
Proc. SPIE 6724, 3rd International Symposium on Advanced Optical Manufacturing and Testing Technologies: Design, Manufacturing, and Testing of Micro- and Nano-Optical Devices and Systems, 67240S (19 November 2007); doi: 10.1117/12.782690
Show Author Affiliations
Tong Guo, Tianjin Univ. (China)
Jin-Ping Chen, Tianjin Univ. (China)
Xing Fu, Tianjin Univ. (China)
Xiao-tang Hu, Tianjin Univ. (China)


Published in SPIE Proceedings Vol. 6724:
3rd International Symposium on Advanced Optical Manufacturing and Testing Technologies: Design, Manufacturing, and Testing of Micro- and Nano-Optical Devices and Systems
Sen Han; Tingwen Xing; Yanqiu Li; Zheng Cui, Editor(s)

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