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Proceedings Paper

Fabrication and characterization of TO packaged high-speed laser modules
Author(s): Ji Min Wen; Yu Liu; Xin Wang; Hai Qing Yuan; Liang Xie
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Paper Abstract

Various high-speed laser modules are fabricated by TO-Packaged processes, such as FP laser modules, DFB laser modules, and VCSEL modules. Furthermore, the resonance among the circuit elements provides an approach to compensating the TO packaging parasitics, and improving the frequency response of the devices. The detailed equivalent circuit model is established to investigate both the laser diode and packaging comprehensively. The small-signal modulation bandwidths of the TO packaged FP laser, DFB laser and the VCSEL modules are more than 10, 9.7 and 8 GHz, respectively.

Paper Details

Date Published: 7 January 2008
PDF: 6 pages
Proc. SPIE 6824, Semiconductor Lasers and Applications III, 682407 (7 January 2008); doi: 10.1117/12.782145
Show Author Affiliations
Ji Min Wen, Institute of Semiconductors (China)
Yu Liu, Institute of Semiconductors (China)
Xin Wang, Institute of Semiconductors (China)
Hai Qing Yuan, Institute of Semiconductors (China)
Liang Xie, Institute of Semiconductors (China)


Published in SPIE Proceedings Vol. 6824:
Semiconductor Lasers and Applications III
Lianghui Chen; Hiroyuki Suzuki; Paul T. Rudy; Ninghua Zhu, Editor(s)

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