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Proceedings Paper

Review of production of microfluidic devices: material, manufacturing and metrology
Author(s): Shiguang Li; Zhiguang Xu; Aaron Mazzeo; Daniel J. Burns; Gang Fu; Matthew Dirckx; Vijay Shilpiekandula; Xing Chen; Nimai C. Nayak; Eehern Wong; Soon Fatt Yoon; Zhong Ping Fang; Kamal Youcef-Toumi; David Hardt; Shu Beng Tor; Chee Yoon Yue; Jung-Hoon Chun
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Paper Abstract

Microfluidic devices play a crucial role in biology, life sciences and many other fields. Three aspects have to be considered in production of microfluidic devices: (i) material properties before and after processing, (ii) tooling and processing methodologies, and (iii) measurements for process control. This paper presents a review of these three areas. The key properties of materials are reviewed from both the production and device performance point of views in this paper. The tooling and processing methodologies considered include both the direct tooling methods and the mold based processing methods. The response of material on the production parameters during hot embossing process are simulated for process control and product quality prediction purpose. Finally, the measurements for process control aspect discuss different measurement approaches, especially the defect inspection, critical dimensional measurements, bonding quality characterization and checking functionality. Simulation and experimental results are used throughout the paper to illustrate the effectiveness of such approaches.

Paper Details

Date Published: 25 April 2008
PDF: 12 pages
Proc. SPIE 6993, MEMS, MOEMS, and Micromachining III, 69930F (25 April 2008); doi: 10.1117/12.781942
Show Author Affiliations
Shiguang Li, Singapore-MIT Alliance (Singapore)
Nanyang Technological Univ. (Singapore)
Singapore Institute of Manufacturing Technology (Singapore)
Zhiguang Xu, Singapore-MIT Alliance (Singapore)
Nanyang Technological Univ. (Singapore)
Singapore Institute of Manufacturing Technology (Singapore)
Aaron Mazzeo, Massachusetts Institute of Technology (United States)
Daniel J. Burns, Massachusetts Institute of Technology (United States)
Gang Fu, Singapore-MIT Alliance (Singapore)
Nanyang Technological Univ. (Singapore)
Matthew Dirckx, Massachusetts Institute of Technology (United States)
Vijay Shilpiekandula, Massachusetts Institute of Technology (United States)
Xing Chen, Singapore-MIT Alliance (Singapore)
Nanyang Technological Univ. (Singapore)
Nimai C. Nayak, Singapore-MIT Alliance (Singapore)
Nanyang Technological Univ. (Singapore)
Eehern Wong, Massachusetts Institute of Technology (United States)
Soon Fatt Yoon, Singapore-MIT Alliance (Singapore)
Nanyang Technological Univ. (Singapore)
Zhong Ping Fang, Singapore Institute of Manufacturing Technology (Singapore)
Kamal Youcef-Toumi, Massachusetts Institute of Technology (United States)
David Hardt, Massachusetts Institute of Technology (United States)
Shu Beng Tor, Singapore-MIT Alliance (Singapore)
Nanyang Technological Univ. (Singapore)
Chee Yoon Yue, Singapore-MIT Alliance (Singapore)
Nanyang Technological Univ. (Singapore)
Jung-Hoon Chun, Massachusetts Institute of Technology (United States)


Published in SPIE Proceedings Vol. 6993:
MEMS, MOEMS, and Micromachining III
Hakan Urey, Editor(s)

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