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Proceedings Paper

Second-generation radiation sensitive 193-nm developable bottom antireflective coatings (DBARC): recent results
Author(s): Francis Houlihan; Alberto Dioses; Lin Zhang; Joseph Oberlander; Alexandra Krawicz; Sumathy Vasanthan; Meng Li; Yayi Wei; PingHung Lu; Mark Neisser
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Paper Abstract

We will discuss our recent results using a second generation radiation sensitive developable 193 Bottom Antireflective coatings (DBARCs). These DBARC materials are made solvent resistant the application of a resist coating on top of them through a crosslinking mechanism that is reversible by acid catalyzed reaction upon exposure of the DBARC/resist stack. Typically this is done by crosslinking a copolymer containing a hydroxyl moiety with a polyfunctional vinylether during post applied bake. This DBARC approach, after exposure, allows for development of the stack in exposed areas down to the substrate eschewing the plasma etch breakthrough needed for conventional bottom antireflective coatings which are irreversibly crosslinked. We will give an update on the performance our latest 193 nm DBARC materials used with different Implant 193 nm resists when using a phase shift mask with off axis illumination.

Paper Details

Date Published: 15 April 2008
PDF: 7 pages
Proc. SPIE 6923, Advances in Resist Materials and Processing Technology XXV, 692330 (15 April 2008); doi: 10.1117/12.781587
Show Author Affiliations
Francis Houlihan, AZ Electronic Materials USA Corp. (United States)
Alberto Dioses, AZ Electronic Materials USA Corp. (United States)
Lin Zhang, AZ Electronic Materials USA Corp. (United States)
Joseph Oberlander, AZ Electronic Materials USA Corp. (United States)
Alexandra Krawicz, AZ Electronic Materials USA Corp. (United States)
Sumathy Vasanthan, AZ Electronic Materials USA Corp. (United States)
Meng Li, AZ Electronic Materials USA Corp. (United States)
Yayi Wei, AZ Electronic Materials USA Corp. (United States)
PingHung Lu, AZ Electronic Materials USA Corp. (United States)
Mark Neisser, AZ Electronic Materials USA Corp. (United States)


Published in SPIE Proceedings Vol. 6923:
Advances in Resist Materials and Processing Technology XXV
Clifford L. Henderson, Editor(s)

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