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Proceedings Paper

Optical links in handheld multimedia devices
Author(s): S. van Geffen; J. Duis; R. Miller
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Paper Abstract

Ever emerging applications in handheld multimedia devices such as mobile phones, laptop computers, portable video games and digital cameras requiring increased screen resolutions are driving higher aggregate bitrates between host processor and display(s) enabling services such as mobile video conferencing, video on demand and TV broadcasting. Larger displays and smaller phones require complex mechanical 3D hinge configurations striving to combine maximum functionality with compact building volumes. Conventional galvanic interconnections such as Micro-Coax and FPC carrying parallel digital data between host processor and display module may produce Electromagnetic Interference (EMI) and bandwidth limitations caused by small cable size and tight cable bends. To reduce the number of signals through a hinge, the mobile phone industry, organized in the MIPI (Mobile Industry Processor Interface) alliance, is currently defining an electrical interface transmitting serialized digital data at speeds >1Gbps. This interface allows for electrical or optical interconnects. Above 1Gbps optical links may offer a cost effective alternative because of their flexibility, increased bandwidth and immunity to EMI. This paper describes the development of optical links for handheld communication devices. A cable assembly based on a special Plastic Optical Fiber (POF) selected for its mechanical durability is terminated with a small form factor molded lens assembly which interfaces between an 850nm VCSEL transmitter and a receiving device on the printed circuit board of the display module. A statistical approach based on a Lean Design For Six Sigma (LDFSS) roadmap for new product development tries to find an optimum link definition which will be robust and low cost meeting the power consumption requirements appropriate for battery operated systems.

Paper Details

Date Published: 25 April 2008
PDF: 10 pages
Proc. SPIE 7001, Photonics in Multimedia II, 70010I (25 April 2008); doi: 10.1117/12.780563
Show Author Affiliations
S. van Geffen, Tyco Electronics (Netherlands)
J. Duis, Tyco Electronics (Netherlands)
R. Miller, Tyco Electronics (United States)


Published in SPIE Proceedings Vol. 7001:
Photonics in Multimedia II
Ari Tervonen; Frank Möllmer, Editor(s)

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