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Proceedings Paper

Flexible embedded active optical link
Author(s): Erwin Bosman; Geert Van Steenberge; Nina Hendrickx; Wim Christiaens; Jan Vanfleteren; Peter Van Daele
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Paper Abstract

The increasing demand and use of optical fibers for sensor-applications and the increasing use of short distance optical communication on backplanes has been witnessed because of their many advantages. The work described in this paper provides a technology platform to increase the integration and compactness of these optical applications. We present the establishment of a bendable package of optical interconnections and opto-electronic components. Standard commercially available GaAs VCSEL's and GaAs photodetectors are thinned down to a thickness of 30 µm and embedded into a stack of cladding-, core- and Polyimide layers. Multimode waveguides are patterned in the core layer to connect the VCSEL and photodiode array's. Laser ablated 45 degrees micro-mirrors couple the light from the embedded opto-electronic components into- and out of the waveguides. The final layer-stack with embedded active optical interconnections is highly flexible and shows no warpage due to a symmetrical layer build-up. Galvanic fan-out of the contact pads of the VCSEL's and PD's is realized by laser ablated via's and sputtered copper tracks in between the layers. The stand-alone optical foil is only 160 μm thick and can reach a minimum bending radius of 0.5 cm. Optical bending losses of the flexible waveguides are lower than 0.25 dB per cm for a 8 mm bending radius at a wavelength of 850 nm.

Paper Details

Date Published: 14 May 2008
PDF: 10 pages
Proc. SPIE 6992, Micro-Optics 2008, 69920V (14 May 2008); doi: 10.1117/12.780493
Show Author Affiliations
Erwin Bosman, Ghent Univ. (Belgium)
Geert Van Steenberge, Ghent Univ. (Belgium)
Nina Hendrickx, Ghent Univ. (Belgium)
Wim Christiaens, Ghent Univ. (Belgium)
Jan Vanfleteren, Ghent Univ. (Belgium)
Peter Van Daele, Ghent Univ. (Belgium)

Published in SPIE Proceedings Vol. 6992:
Micro-Optics 2008
Hugo Thienpont; Peter Van Daele; Jürgen Mohr; Mohammad R. Taghizadeh, Editor(s)

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