Share Email Print

Proceedings Paper

Microstructure and mechanical properties of pressureless sintered B4C-C composite using phenolic resin
Author(s): A. Nikravan; H. R. Baharvandi; F. B. Jebelli; H. Abdizadeh; N. Ehsani
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

Boron carbide is an extremely promising material for a variety of applications that require high hardness and good wear resistance. However, due to the very high sintering temperatures which are required for B4C densification, wide spread use of that is limited. Various solutions have been studied to modifying densification behavior of B4C. Pressureless sintering in the presence of different additives has been tried by researchers. The effect of additives such as TiB2, SiC, Al, B, ZrO2, talc and Si have been evaluated. It was shown that the densification and mechanical properties may be improved with sintering aids. The Effects of phenolic resin additive on the microstructure and mechanical properties of B4C were explained in this study. Experimental composition was batched corresponding from 0 to 10 wt% of the additive. All samples were sintered for 60 minutes at 2150°C. The heating and cooling rates were 10°C/min for all samples. It was found that below 7.5 wt% of phenolic resin additive, the density increased with additive increasing and above that, decreased by phenolic resin addition. Mechanical properties such as fracture toughness, strength and hardness increased as a result of densification enhancement.

Paper Details

Date Published: 27 November 2007
PDF: 7 pages
Proc. SPIE 6423, International Conference on Smart Materials and Nanotechnology in Engineering, 64235M (27 November 2007); doi: 10.1117/12.780337
Show Author Affiliations
A. Nikravan, Malek Ashtar Univ. of Technology (Iran)
H. R. Baharvandi, Malek Ashtar Univ. of Technology (Iran)
F. B. Jebelli, Univ. of Tehran (Iran)
H. Abdizadeh, Univ. of Tehran (Iran)
N. Ehsani, Malek Ashtar Univ. of Technology (Iran)

Published in SPIE Proceedings Vol. 6423:
International Conference on Smart Materials and Nanotechnology in Engineering
Shanyi Du; Jinsong Leng; Anand K. Asundi, Editor(s)

© SPIE. Terms of Use
Back to Top