Share Email Print
cover

Proceedings Paper

Design and simulation of MEMS silicon micro-cantilever resonant sensor
Author(s): Chengjun Qiu; Dan Bu; Wei Qu; Maosheng Cao
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

A silicon resonant sensor with micro-cantilever structure based on MEMS technology is investigated. According to the principle of MEMS silicon micro-cantilever resonant sensor, the structure of sensor is designed and the locations of thermal excited and detected resistors are fixed respectively. With the IntelliSuite software, the dynamic characteristics are analyzed, and the relationship between dimensions and inherent frequency of resonant sensor is discussed. The conclusion shows that the inherent frequency is independent of cantilever width, but proportional to thickness directly. And also it shows a nonlinear proportional to length inversely. Furthermore, a feasible fabrication technology is made through experiment research. In order to acquire a perfectly micro-cantilever structure, a corner undercutting compensation is applied in KOH anisotropic etching, and the effect of compensation is well. Thus, the process periods decreases greatly by the simulation, the design result and quality are improved effectively, and it is useful to the actual production for MEMS sensors.

Paper Details

Date Published: 1 November 2007
PDF: 6 pages
Proc. SPIE 6423, International Conference on Smart Materials and Nanotechnology in Engineering, 642359 (1 November 2007); doi: 10.1117/12.780093
Show Author Affiliations
Chengjun Qiu, Heilongjiang Univ. (China)
Beijing Institute of Technology (China)
Dan Bu, Heilongjiang Univ. (China)
Wei Qu, Heilongjiang Univ. (China)
Maosheng Cao, Beijing Institute of Technology (China)


Published in SPIE Proceedings Vol. 6423:
International Conference on Smart Materials and Nanotechnology in Engineering

© SPIE. Terms of Use
Back to Top