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Proceedings Paper

Study on mechanical property of PI/SiO2 nano-hybrid film
Author(s): Mingyan Zhang; Ying Niu; Yong Fan; Tiequan Dong; Shujin Zeng
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Paper Abstract

Polyimide/Silica (PI/SiO2) nano-hybrid films have been prepared through the Sol-Gel process by mixing various proportions of Methyltriethoxysilane (MTEOS) with polyamic acid (PAA). The fracture morphologies of PI/SiO2 hybrid films were characterized by Scanning Electron Microscope (SEM), and the result showed that silica particles dispersed in PI matrix finely. The sizes of silica particles increased with silica content, and the shapes of silica particle were rod-like. The inorganic phase changed from isolated silica particles to interconnected network with the PI matrix with increasing silica content. The curve of wide-angle X-Ray diffraction (WXRD) confirmed that the introduction of silica destroyed the ordering of PI molecular chains. The mechanical properties of hybrid films were measured by Electron Universal Testing Machine, and the results indicated that the tensile strength and elongation at the break of hybrid films reached to maximum at silica content of 1wt%. Compared with pure PI film, the tensile strength was improved 8wt%, and the elongation at the break of hybrid films was improved 10wt%. The two parameter of hybrid films were equal to pure PI film's at silica content from 1wt% and 5wt%. But, the two parameter decreased with increasing silica content (more than 5wt%).

Paper Details

Date Published: 1 November 2007
PDF: 6 pages
Proc. SPIE 6423, International Conference on Smart Materials and Nanotechnology in Engineering, 64234V (1 November 2007); doi: 10.1117/12.780075
Show Author Affiliations
Mingyan Zhang, Harbin Univ. of Science and Technology (China)
Ying Niu, Harbin Univ. of Science and Technology (China)
Yong Fan, Harbin Univ. of Science and Technology (China)
Tiequan Dong, Harbin Univ. of Science and Technology (China)
Shujin Zeng, Harbin Univ. of Science and Technology (China)


Published in SPIE Proceedings Vol. 6423:
International Conference on Smart Materials and Nanotechnology in Engineering

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