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Proceedings Paper

Analysis and design for the thermo-smart structure of composite with TEC
Author(s): Zhong-Min Deng; Xian-Li Cheng; Xiao-Qun Wang
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Paper Abstract

Based on the properties of thermoelectric cooler (TEC), a thermal analysis model for the thermo-smart structure of composite with TECs is built. Some parameters which affect the temperature distribution of the structure are designed, such as the location of TECs and the thermal boundary conditions. A temperature control system is designed for the thermo-smart structure and simulated in SIMULINK. The results of simulation indicate that the structure combined with PI controller performs greatly to temperature control. The applications of smart thermal structure on cooling design of computer chips and infrared stealth will benefit from the paper's results.

Paper Details

Date Published: 27 November 2007
PDF: 8 pages
Proc. SPIE 6423, International Conference on Smart Materials and Nanotechnology in Engineering, 642336 (27 November 2007); doi: 10.1117/12.780052
Show Author Affiliations
Zhong-Min Deng, Beijing Univ. of Aeronautics and Astronautics (China)
Xian-Li Cheng, Beijing Univ. of Aeronautics and Astronautics (China)
Xiao-Qun Wang, Beijing Univ. of Aeronautics and Astronautics (China)


Published in SPIE Proceedings Vol. 6423:
International Conference on Smart Materials and Nanotechnology in Engineering

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