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Proceedings Paper

Damping capacity of TiNi-based shape memory alloys
Author(s): L. J. Rong; H. C. Jiang; S. W. Liu; X. Q. Zhao
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Paper Abstract

Damping capacity is another primary characteristic of shape memory alloys (SMA) besides shape memory effect and superelasticity. Damping behavior of Ti-riched TiNi SMA, porous TiNi SMA and a novel TiNi/AlSi composite have been investigated using dynamic mechanical analyzer (DMA) in this investigation. All these alloys are in martensitic state at room temperature and thus possess the high potential application value. Ti50.2Ni49.8 SMA has better damping capacity in pure martensitic state and phase transformation region due to the motion of martensite twin interface. As a kind of promising material for effective dampers and shock absorbing devices, porous TiNi SMA can exhibit higher damping capacity than the dense one due to the existence of the three-dimensioned connecting pore structure. It is found that the internal friction of porous TiNi SMA mainly originates from microplastic deformation and mobility of martensite interface and increases with the increase of the porosity. A novel TiNi/AlSi composite has been developed successfully by infiltrating AlSi alloy into the open pores of porous TiNi alloy with 60% porosity through compression casting. It shows the same phase transformation characteristics as the porous TiNi alloy. The damping capacity of the composite has been increased and the compressive strength has been also promoted remarkably. Suggestions for developing higher damping alloys based on TiNi shape memory alloy are proposed in this paper.

Paper Details

Date Published: 1 November 2007
PDF: 7 pages
Proc. SPIE 6423, International Conference on Smart Materials and Nanotechnology in Engineering, 64232X (1 November 2007); doi: 10.1117/12.780026
Show Author Affiliations
L. J. Rong, Institute of Metal Research (China)
H. C. Jiang, Institute of Metal Research (China)
S. W. Liu, Institute of Metal Research (China)
X. Q. Zhao, Beijing Univ. of Aeronautics and Astronautics (China)

Published in SPIE Proceedings Vol. 6423:
International Conference on Smart Materials and Nanotechnology in Engineering

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