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Proceedings Paper

Preparation and characterization of self-healing poly (urea-formaldehyde) microcapsules
Author(s): Haiyan Li; Rongguo Wang; Xiaodong He; Wenbo Liu; Huanying Hao
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Paper Abstract

It is a novel study field for automatic healing composite by using microcapsules. A series of microcapsules are prepared by in-situ polymerization technology with poly (urea-formaldehyde) (PUF) as a shell material and dicyclopentadiene (DCPD) as core materials. The effects of surfactant on the physical properties of poly (urea-formaldehyde) microcapsules were researched by using Styrene/maleic anhydride copolymer (SMA), Polyvinyl alcohol (PVA) and sodium dodecylbenzene sulfonate (DBS) solutions of different concentration. The properties of microcapsules, including the surface morphology, chemical structure, and thermal properties of microcapsules are characterized by using Optics microscope (OM), Fourier transfer infrared spectroscopy (FTIR), Differential scanning calorimetry (DSC) and Thermal gravity analysis (TGA). The content of core material was calculated. The results indicated that PUF microcapsules can be synthesized successfully. The DBS was favorable to microcapsulation and the microcapsules had smooth outer surface when the concentration of DBS was close to critical micelle concentration (CMC). The PUF microcapsules filled with DCPD had the content of DCPD was 85% and exhibit a good chemical stability below 218°C.

Paper Details

Date Published: 1 November 2007
PDF: 6 pages
Proc. SPIE 6423, International Conference on Smart Materials and Nanotechnology in Engineering, 64232T (1 November 2007); doi: 10.1117/12.779891
Show Author Affiliations
Haiyan Li, Harbin Institute of Technology (China)
Rongguo Wang, Harbin Institute of Technology (China)
Xiaodong He, Harbin Institute of Technology (China)
Wenbo Liu, Harbin Institute of Technology (China)
Huanying Hao, Harbin Institute of Technology (China)

Published in SPIE Proceedings Vol. 6423:
International Conference on Smart Materials and Nanotechnology in Engineering
Shanyi Du; Jinsong Leng; Anand K. Asundi, Editor(s)

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