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Proceedings Paper

Thermal and electrical performance of a-Si microbolometer focal plane arrays
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Paper Abstract

Recent advances of microelectromechanical system (MEMS) technology have opened new opportunities for amorphous silicon (α-Si) microbolometer focal plane arrays (FPAs) both for military and civil applications. α-Si membrane is chosen for sensitive material of microbolometer FPAs due to its high temperature coefficient of resistance (TCR), high resistivity and good mechanical properties. However, α-Si membrane also has the disadvantage of high 1/f noise, strict preparation conditions and metastable effect. So nowadays, researches are focused on properties of α-Si membrane to gain high performance of microbolometer FPAs. Since the pulsed bias readout mode of microbolometer FPAs causes a non-steady-state of α-Si membrane during the operation, the transient thermal-electrical response process of the sensing pixel is analyzed detailedly in this paper to predict the thermal and electrical performance of α-Si microbolemeter FPAs such as responsivity, noise equivalent temperature difference (NETD), detectivity and power dissipation. Numerical simulations are presented to investigate the factor which affects the performance of α-Si microbolometer FPAs. The imaging experiment results obtained from a 320×240 α-Si microbolemeter FPA are in good agreement with the theoretical analysis. The way to improve the performance of α-Si microbolemeter FPAs is given in the end of this paper.

Paper Details

Date Published: 1 November 2007
PDF: 6 pages
Proc. SPIE 6423, International Conference on Smart Materials and Nanotechnology in Engineering, 64232D (1 November 2007); doi: 10.1117/12.779855
Show Author Affiliations
Lianjun Sun, Nanjing Univ. of Science and Technology (China)
Benkang Chang, Nanjing Univ. of Science and Technology (China)
Junju Zhang, Nanjing Univ. of Science and Technology (China)
Yunsheng Qian, Nanjing Univ. of Science and Technology (China)
Yafeng Qiu, Nanjing Univ. of Science and Technology (China)


Published in SPIE Proceedings Vol. 6423:
International Conference on Smart Materials and Nanotechnology in Engineering

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