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Proceedings Paper

Very compact FTTH Diplexer design using advanced wafer level fabrication methods
Author(s): Christophe Kopp; Philippe Grosse; Philippe Gilet; Nicolas Olivier; Alexei Chelnokov; Laurent Fulbert; Stéphane Bernabé; Cyrille Rossat; Régis Hamelin; Ivar Hamberg; Lennart Lundqvist; Nicolae Chitica; Matthias Hammar; Jesper Berggren; Stéphane Junique; Qin Wang; Susanne Almqvist; Christian Sillans
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Paper Abstract

FTTH networks require implementing a diplexer at each user termination. According to most of the standards, this diplexer detects a download signal beam at 1.49μm and emits an upload signal beam at 1.31μm on the same single mode fibre. Both signals exhibit datarate speed below 2.5Gbps. Today, most of the diplexers are obtained by actively aligning a set of individual optoelectronic components and micro-optics. However, new manufacturing solutions satisfying very low cost and mass production capability requirements of this market would help to speed the massive spreading of this technology. In this paper, we present an original packaging design to manufacture Diplexer Optical Sub-Assembly for FTTH application. A dual photodiode is stacked over a VCSEL and detects both the download signal beam at 1.49μm passing through the laser and one part of the upload signal beam at 1.31μm for monitoring. To satisfy this approach, an innovative VCSEL has been designed to have a very high transmission at 1.49μm. All these components are mounted on a very small circuit board on glass including also integrated circuits such as transimpedance amplifier. So, the device combines advanced optoelectronic components and highly integrated Multi-Chip-Module on glass approach using collective wafer-level assembling technologies. For the single mode fibre optical coupling, active and passive alignment solutions are considered.

Paper Details

Date Published: 14 May 2008
PDF: 10 pages
Proc. SPIE 6992, Micro-Optics 2008, 699203 (14 May 2008); doi: 10.1117/12.779746
Show Author Affiliations
Christophe Kopp, CEA-LETI (France)
Philippe Grosse, CEA-LETI (France)
Philippe Gilet, CEA-LETI (France)
Nicolas Olivier, CEA-LETI (France)
Alexei Chelnokov, CEA-LETI (France)
Laurent Fulbert, CEA-LETI (France)
Stéphane Bernabé, IntexyS Photonics (France)
Cyrille Rossat, IntexyS Photonics (France)
Régis Hamelin, IntexyS Photonics (France)
Ivar Hamberg, Zarlink (Sweden)
Lennart Lundqvist, Zarlink (Sweden)
Nicolae Chitica, Zarlink (Sweden)
Matthias Hammar, KTH (Sweden)
Jesper Berggren, KTH (Sweden)
Stéphane Junique, Acreo AB (Sweden)
Qin Wang, Acreo AB (Sweden)
Susanne Almqvist, Acreo AB (Sweden)
Christian Sillans, IFOTEC (France)

Published in SPIE Proceedings Vol. 6992:
Micro-Optics 2008
Hugo Thienpont; Peter Van Daele; Jürgen Mohr; Mohammad R. Taghizadeh, Editor(s)

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