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Optical modulation techniques for analog signal processing and CMOS compatible electro-optic modulationFormat | Member Price | Non-Member Price |
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Paper Abstract
Integrating electronic and photonic functions onto a single silicon-based chip using techniques compatible with mass-production
CMOS electronics will enable new design paradigms for existing system architectures and open new
opportunities for electro-optic applications with the potential to dramatically change the management, cost, footprint,
weight, and power consumption of today's communication systems. While broadband analog system applications
represent a smaller volume market than that for digital data transmission, there are significant deployments of analog
electro-optic systems for commercial and military applications. Broadband linear modulation is a critical building block
in optical analog signal processing and also could have significant applications in digital communication systems.
Recently, broadband electro-optic modulators on a silicon platform have been demonstrated based on the plasma
dispersion effect. The use of the plasma dispersion effect within a CMOS compatible waveguide creates new challenges
and opportunities for analog signal processing since the index and
propagation loss change within the waveguide during
modulation. We will review the current status of silicon-based electrooptic modulators and also linearization techniques
for optical modulation.
Paper Details
Date Published: 13 February 2008
PDF: 11 pages
Proc. SPIE 6898, Silicon Photonics III, 689803 (13 February 2008); doi: 10.1117/12.777113
Published in SPIE Proceedings Vol. 6898:
Silicon Photonics III
Joel A. Kubby; Graham T. Reed, Editor(s)
PDF: 11 pages
Proc. SPIE 6898, Silicon Photonics III, 689803 (13 February 2008); doi: 10.1117/12.777113
Show Author Affiliations
Douglas M. Gill, Alcatel-Lucent Bell Labs. (United States)
Mahmoud Rasras, Alcatel-Lucent Bell Labs. (United States)
Kun-Yii Tu, Alcatel-Lucent Bell Labs. (United States)
Young-Kai Chen, Alcatel-Lucent Bell Labs. (United States)
Alice E. White, Alcatel-Lucent Bell Labs. (United States)
Sanjay S. Patel, Alcatel-Lucent Bell Labs. (United States)
Daniel Carothers, BAE Systems (United States)
Andrew Pomerene, BAE Systems (United States)
Mahmoud Rasras, Alcatel-Lucent Bell Labs. (United States)
Kun-Yii Tu, Alcatel-Lucent Bell Labs. (United States)
Young-Kai Chen, Alcatel-Lucent Bell Labs. (United States)
Alice E. White, Alcatel-Lucent Bell Labs. (United States)
Sanjay S. Patel, Alcatel-Lucent Bell Labs. (United States)
Daniel Carothers, BAE Systems (United States)
Andrew Pomerene, BAE Systems (United States)
Robert Kamocsai, BAE Systems (United States)
James Beattie, BAE Systems (United States)
Anthony Kopa, Cornell Univ. (United States)
Alyssa Apsel, Cornell Univ. (United States)
Mark Beals, Massachusetts Institute of Technology (United States)
Jurgen Mitchel, Massachusetts Institute of Technology (United States)
Jifeng Liu, Massachusetts Institute of Technology (United States)
Lionel C. Kimerling, Massachusetts Institute of Technology (United States)
James Beattie, BAE Systems (United States)
Anthony Kopa, Cornell Univ. (United States)
Alyssa Apsel, Cornell Univ. (United States)
Mark Beals, Massachusetts Institute of Technology (United States)
Jurgen Mitchel, Massachusetts Institute of Technology (United States)
Jifeng Liu, Massachusetts Institute of Technology (United States)
Lionel C. Kimerling, Massachusetts Institute of Technology (United States)
Published in SPIE Proceedings Vol. 6898:
Silicon Photonics III
Joel A. Kubby; Graham T. Reed, Editor(s)
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