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Proceedings Paper

Development of new BARC for immersion process using hyper NA
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Paper Abstract

Most semiconductor companies are using Bottom Anti-Reflective Coating (BARC) on their lithography process to reduce bottom reflectivity, which is cause of standing wave, pattern collapse, and bad pattern profile, and to improve lithographic performance. BARC has been diversified to adapt to the wavelength of exposure light and refractive indices of photoresists and substrates. Recently, many semiconductor companies introduce new process, such as immersion process and double patterning process, to get high resolution for next generation semiconductor and they are trying to apply these processes to their mass production. Among those process solutions, a strong candidate for high resolution is introduction of hyper NA(Numerical Aperture) exposure tool, using immersion process. There is one thing to solve for BARC material when immersion process is applied. It is reflectivity. As NA of exposure tool increases, reflectivity from a substrate also increases, simultaneously. We simulated the difference of reflectivity with increasing NA and we found a proper way how to control reflectivity on immersion process with refractive indices of BARC. We will report simulation data for immersion process and introduce our new developed BARC for hyper NA process in this paper.

Paper Details

Date Published: 26 March 2008
PDF: 10 pages
Proc. SPIE 6923, Advances in Resist Materials and Processing Technology XXV, 69232T (26 March 2008); doi: 10.1117/12.776801
Show Author Affiliations
Hyo Jung Roh, Dongjin Semichem Co. Ltd. (South Korea)
Man Ho Han, Dongjin Semichem Co. Ltd. (South Korea)
Sang Jeoung Kim, Dongjin Semichem Co. Ltd. (South Korea)
Hyun Jin Kim, Dongjin Semichem Co. Ltd. (South Korea)
Jaehyun Kim, Dongjin Semichem Co. Ltd. (South Korea)
Keun Kyu Kong, Hynix Semiconductor Inc. (South Korea)
Ki Lyoung Lee, Hynix Semiconductor Inc. (South Korea)
Sung Koo Lee, Hynix Semiconductor Inc. (South Korea)
Dong Heok Park, Hynix Semiconductor Inc. (South Korea)


Published in SPIE Proceedings Vol. 6923:
Advances in Resist Materials and Processing Technology XXV
Clifford L. Henderson, Editor(s)

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