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Proceedings Paper

Automated method of detecting SRAF and sidelobe printing with automated CD-SEM recipes
Author(s): Mary Coles; Yong Seok Choi; Kyoungmo Yang; Cindy Parker; Andy Self
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Paper Abstract

In development of optical proximity correction (OPC) for new technology nodes, optimization of assist features requires multiple placement scenarios for each line/space or hole combination. Additionally, illumination and process conditions are varied to determine the optimal process window. Under some illumination and process conditions, optimal printing of the desired features is attained; however, undesired printing of sidelobes or sub-resolution assist features (SRAFs) also occurs. Currently, CD sizes are measured for the desired feature and images are hand checked for unwanted features (sidelobe or SRAF printing). This takes a large amount of time, given the hundreds to thousands of CDSEM measurements required to generate a given OPC model. This problem is multiplied if several passes of data collection are needed to optimize each OPC model and each layer. An automated method has been developed to quickly screen a large number of SEM images for unwanted features, and if they exist, flag the measurement point so it can be easily identified as an undesirable area of the process window. This method employs edge placement measurement capabilities available with automated SEM recipe generation software to identify the presence of an unwanted feature within a given image. A simple Boolean filter is used to exclude this process area as SRAF or sidelobe printing process space so it may be excluded from the OPC model and from the operational process space. This automated method for identification of SRAFs or sidelobes provides significant engineering time savings and allows characterization of the onset of undesirable features to assist in optimization of OPC within a given process window.

Paper Details

Date Published: 7 March 2008
PDF: 10 pages
Proc. SPIE 6924, Optical Microlithography XXI, 692430 (7 March 2008); doi: 10.1117/12.775808
Show Author Affiliations
Mary Coles, Texas Instruments, Inc. (United States)
Yong Seok Choi, Texas Instruments, Inc. (United States)
Kyoungmo Yang, Hitachi High-Technologies Corp. (Japan)
Cindy Parker, Hitachi High Technologies America, Inc (United States)
Andy Self, Hitachi High Technologies America, Inc (United States)


Published in SPIE Proceedings Vol. 6924:
Optical Microlithography XXI
Harry J. Levinson; Mircea V. Dusa, Editor(s)

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