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Proceedings Paper

A lithographic and process assessment of photoresist stabilization for double-patterning using 172-nm photoresist curing
Author(s): Nikolaos Bekiaris; Hiram Cervera; Junyan Dai; Ryoung-han Kim; Alden Acheta; Thomas Wallow; Jongwook Kye; Harry J. Levinson; Thomas Nowak; James Yu
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Paper Abstract

We have developed a unique resist stabilization process for double patterning that uses 172 nm UV curing to 'freeze' a first photoresist pattern prior to application and patterning of a second photoresist film. 172 nm cure offers many potential advantages over other resist stabilization processes, including improved pattern fidelity vs. other cure processes and track-based implementation scenarios that are relatively simple, compact, and inexpensive. Assessment of 172 nm double imaging process requirements and limitations indicates that pattern distortions in the 'frozen' first photoresist may arise during all 2nd patterning steps, including coating, exposure, and development. Careful optimization to maximize overall pattern fidelity is needed. Process optimization using a conventional 193 nm photoresist suggests that pattern freeze approaches based on resist cure are best suited to extremely regular structures due to line-end and other resist distortions. Nevertheless, the method allows cross-grid contact printing at lithographic k1 = 0.385.

Paper Details

Date Published: 15 April 2008
PDF: 8 pages
Proc. SPIE 6923, Advances in Resist Materials and Processing Technology XXV, 692321 (15 April 2008); doi: 10.1117/12.774205
Show Author Affiliations
Nikolaos Bekiaris, Sokudo Co., Ltd. (United States)
Hiram Cervera, Sokudo Co., Ltd. (United States)
Junyan Dai, Sokudo Co., Ltd. (United States)
Ryoung-han Kim, Advanced Micro Devices, Inc. (United States)
Alden Acheta, Spansion LLC (United States)
Thomas Wallow, Advanced Micro Devices, Inc. (United States)
Jongwook Kye, Advanced Micro Devices, Inc. (United States)
Harry J. Levinson, Advanced Micro Devices, Inc. (United States)
Thomas Nowak, Applied Materials, Inc. (United States)
James Yu, Applied Materials, Inc. (United States)


Published in SPIE Proceedings Vol. 6923:
Advances in Resist Materials and Processing Technology XXV
Clifford L. Henderson, Editor(s)

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