Share Email Print
cover

Proceedings Paper

Development of thick negative photoresists for electroplating applications
Author(s): Chunwei Chen; Robert Plass; Edward Ng; Sam Lee; Stephen Meyer; Georg Pawlowski; Rozalia Beica
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

We report about the development of a thick negative photoresist series, AZ(R) EXP 125nXT, and their use in electroplating levels up to 160 μm thickness. The new photoresist series enables coatings of 5-120 μm with acceptable uniformity and edge bead in a single coat step. 200 μm photoresist coating was achieved by a double coating processes. The lithographic performance of the photoresists was evaluated using broad band aligners and steppers. Optimized lithographic parameters to achieve straight and nearly vertical side wall profiles are reported. The photoresists show not only excellent adhesion to copper with no surface treatment and electroplating tolerance in a variety of metal plating solutions, but is also compatible with silicon and gold substrates. The photoresists have been found to be easily stripped with no residues in solvent based stripper solutions.

Paper Details

Date Published: 26 March 2008
PDF: 8 pages
Proc. SPIE 6923, Advances in Resist Materials and Processing Technology XXV, 69233E (26 March 2008); doi: 10.1117/12.773986
Show Author Affiliations
Chunwei Chen, AZ Electronic Materials USA Corp. (United States)
Robert Plass, AZ Electronic Materials USA Corp. (United States)
Edward Ng, AZ Electronic Materials USA Corp. (United States)
Sam Lee, AZ Electronic Materials USA Corp. (United States)
Stephen Meyer, AZ Electronic Materials USA Corp. (United States)
Georg Pawlowski, AZ Electronic Materials USA Corp. (United States)
Rozalia Beica, Semitool, Inc. (United States)


Published in SPIE Proceedings Vol. 6923:
Advances in Resist Materials and Processing Technology XXV
Clifford L. Henderson, Editor(s)

© SPIE. Terms of Use
Back to Top