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Proceedings Paper

High-etch-rate low-bias bow outgassing BARC via-filling materials for 193-nm ArF lithographic process
Author(s): Huirong Yao; Zhong Xiang; Salem Mullen; Jian Yin; Walter Liu; Jianhui Shan; Elleazar Gonzalez; Guanyang Lin; Mark Neisser
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Paper Abstract

As critical dimensions in integrated circuit (IC) device fabrication continue to shrink to less than 90 nm, designing multi-functional organic bottom anti-reflective coating (BARC) materials has become a challenge. In this paper, we report novel high performance BARC materials which are simultaneously capable of controlling reflectivity, planarizing on substrate surface, low bias filling without forming voids, low outgassing, high etch selectivity with resists and broad compatibility with resists. The new materials comprise of a chromophore that absorbs at 193 nm to give anti-reflective properties. By intriguing design of the crosslinking system to minimize the amount of low molecular weight additives and the by-product formation in the curing process, low-bias and low sublimation filling without formation of voids are achieved. In addition, the performance of the high etch rate BARC material can be further enhanced by blending with a low k high etch rate (~2.4X) material to achieve ultra high etch rate for ArF lithographic process. The filling properties, etch selectivity, lithographic and outgassing data of the new BARC materials will be presented.

Paper Details

Date Published: 15 April 2008
PDF: 10 pages
Proc. SPIE 6923, Advances in Resist Materials and Processing Technology XXV, 69232J (15 April 2008); doi: 10.1117/12.773400
Show Author Affiliations
Huirong Yao, AZ Electronic Materials USA Corp. (United States)
Zhong Xiang, AZ Electronic Materials USA Corp. (United States)
Salem Mullen, AZ Electronic Materials USA Corp. (United States)
Jian Yin, AZ Electronic Materials USA Corp. (United States)
Walter Liu, AZ Electronic Materials USA Corp. (United States)
Jianhui Shan, AZ Electronic Materials USA Corp. (United States)
Elleazar Gonzalez, AZ Electronic Materials USA Corp. (United States)
Guanyang Lin, AZ Electronic Materials USA Corp. (United States)
Mark Neisser, AZ Electronic Materials USA Corp. (United States)


Published in SPIE Proceedings Vol. 6923:
Advances in Resist Materials and Processing Technology XXV
Clifford L. Henderson, Editor(s)

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