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Proceedings Paper

Performance of the full field EUV systems
Author(s): Hans Meiling; Edwin Boon; Nico Buzing; Kevin Cummings; Olav Frijns; Judy Galloway; Mieke Goethals; Noreen Harned; Bas Hultermans; Roel de Jonge; Bart Kessels; Peter Kürz; Sjoerd Lok; Martin Lowisch; Joerg Mallman; Bill Pierson; Kurt Ronse; James Ryan; Emil Smitt-Weaver; Michael Tittnich; Christian Wagner; Andre van Dijk; John Zimmerman
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Paper Abstract

The ASML extreme ultraviolet lithography (EUV) alpha demo tool is a 0.25NA fully functional lithography tool with a field size of 26×33 mm2, enabling process development for sub-40-nm technology. Two exposure tools are installed at customer facilities, and are equipped with a Sn discharge source. In this paper we present data measured at intermediate focus of the Sn source-collector module. We also present performance data from both exposure tools, show the latest results of resist exposures including excellent 32-nm half pitch dense staggered and aligned contact hole images, and present the highlights of the first demonstration of an electrically functional full field device with one of the layers made using EUVL in ASML's alpha demo tool.

Paper Details

Date Published: 21 March 2008
PDF: 13 pages
Proc. SPIE 6921, Emerging Lithographic Technologies XII, 69210L (21 March 2008); doi: 10.1117/12.773259
Show Author Affiliations
Hans Meiling, ASML Netherlands B.V. (Netherlands)
Edwin Boon, ASML Netherlands B.V. (Netherlands)
Nico Buzing, ASML Netherlands B.V. (Netherlands)
Kevin Cummings, ASML (United States)
Olav Frijns, ASML Netherlands B.V. (Netherlands)
Judy Galloway, ASML (United States)
Mieke Goethals, IMEC (Belgium)
Noreen Harned, ASML Wilton (United States)
Bas Hultermans, ASML Netherlands B.V. (Netherlands)
Roel de Jonge, ASML Netherlands B.V. (Netherlands)
Bart Kessels, ASML (United States)
Peter Kürz, Carl Zeiss SMT AG (Germany)
Sjoerd Lok, ASML Netherlands B.V. (Netherlands)
Martin Lowisch, Carl Zeiss SMT AG (Germany)
Joerg Mallman, ASML Netherlands B.V. (Netherlands)
Bill Pierson, ASML (United States)
Kurt Ronse, IMEC (Belgium)
James Ryan, Univ. at Albany (United States)
Emil Smitt-Weaver, ASML (United States)
Michael Tittnich, Univ. at Albany (United States)
Christian Wagner, ASML Netherlands B.V. (Netherlands)
Andre van Dijk, ASML Netherlands B.V. (Netherlands)
John Zimmerman, ASML Wilton (United States)

Published in SPIE Proceedings Vol. 6921:
Emerging Lithographic Technologies XII
Frank M. Schellenberg, Editor(s)

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