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Proceedings Paper

A new high-resolution photomask inspection system for contamination detection
Author(s): Bo Mu; Aditya Dayal; Lih-Huah Yiin; Jinggang Zhu; John Miller; Gregg Inderhees
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Paper Abstract

STARlight2+TM (SL2+) is a new high-resolution contamination inspection system based upon the KLA-Tencor TerascanHR platform. Building upon the proven technology of STARlightTM (SL2), SL2+ uses transmitted and reflected images to detect potentially yield-limiting contamination defects on photomasks for wafer fabs and mask shops. It extends the contamination inspection capability to the 32nm logic/45nm Half Pitch (HP) technology nodes using the newly developed 72nm pixel image resolution as well as a significantly improved rendering model in the algorithm. In this paper, we present inspection results on a wide variety of photomasks, spanning the 32nm to 110nm technology nodes, in the recently concluded period of Alpha tests on the SL2+ system. The test results show that the sensitivity and the inspection capability of the new SL2+ system have been greatly improved. Such improvement enables wafer fabs and mask shops to inspect and qualify photomasks for 32nm node development and 45nm node production.

Paper Details

Date Published: 24 March 2008
PDF: 8 pages
Proc. SPIE 6922, Metrology, Inspection, and Process Control for Microlithography XXII, 69222B (24 March 2008); doi: 10.1117/12.773201
Show Author Affiliations
Bo Mu, KLA-Tencor Corp. (United States)
Aditya Dayal, KLA-Tencor Corp. (United States)
Lih-Huah Yiin, KLA-Tencor Corp. (United States)
Jinggang Zhu, KLA-Tencor Corp. (United States)
John Miller, KLA-Tencor Corp. (United States)
Gregg Inderhees, KLA-Tencor Corp. (United States)


Published in SPIE Proceedings Vol. 6922:
Metrology, Inspection, and Process Control for Microlithography XXII
John A. Allgair; Christopher J. Raymond, Editor(s)

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