Share Email Print

Proceedings Paper

Cell-based OPC with standard-cell fill insertion
Author(s): Liang Deng; Kai-Yuan Chao; Hua Xiang; Martin D. F. Wong
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Litho-aware design methodology is the key to enable the aggressive scaling down to the future technology node. Boundary based methodology for cellwise OPC has been proposed to account for influence from features of neighboring cells. As technology advances toward 32 and 22 nm, more columns of features are needed as representative environments for the boundary-based cellwise OPC. In this paper, we propose a new method that combines the fill insertion and boundary-based cellwise OPC to reduce the mask data size as well as the prohibitive runtime of full-chip OPC, making cell characterization more predictable. To make the number of cell OPC solutions easy to handle, we present a new methodology which uses dummy fill insertion both inside and outside cells to solve the issue for technologies beyond 45 nm. Experimental results show a solid 30% improvement on average and maximum edge placement errors (EPE) over the previous work.

Paper Details

Date Published: 4 March 2008
PDF: 8 pages
Proc. SPIE 6925, Design for Manufacturability through Design-Process Integration II, 69251L (4 March 2008); doi: 10.1117/12.773192
Show Author Affiliations
Liang Deng, Univ. of Illinois at Urbana-Champaign (United States)
Kai-Yuan Chao, Intel Corp. (United States)
Hua Xiang, IBM Watson Research Ctr. (United States)
Martin D. F. Wong, Univ. of Illinois at Urbana-Champaign (United States)

Published in SPIE Proceedings Vol. 6925:
Design for Manufacturability through Design-Process Integration II
Vivek K. Singh; Michael L. Rieger, Editor(s)

© SPIE. Terms of Use
Back to Top