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Proceedings Paper

Wafer edge polishing process for defect reduction during immersion lithography
Author(s): Motoya Okazaki; Raymond Maas; Sen-Hou Ko; Yufei Chen; Paul Miller; Mani Thothadri; Manjari Dutta; Chorng-Ping Chang; Abraham Anapolsky; Chris Lazik; Yuri Uritsky; Martin Seamons; Deenesh Padhi; Wendy Yeh; Stephan Sinkwitz; Chris Ngai
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Paper Abstract

The objective of this study was to examine the defect reduction effect of the wafer edge polishing step on the immersion lithography process. The experimental wafers were processed through a typical front end of line device manufacturing process and half of the wafers were processed with the wafer edge polishing just prior to the immersion lithography process. The experimental wafers were then run through two immersion lithography experiments and the defect adders on these wafers were compared and analyzed. The experimental results indicated a strong effect of the edge polishing process on reducing the particle migration from the wafer edge region to the wafer surface during the immersion lithography process.

Paper Details

Date Published: 25 March 2008
PDF: 10 pages
Proc. SPIE 6922, Metrology, Inspection, and Process Control for Microlithography XXII, 69223A (25 March 2008); doi: 10.1117/12.773113
Show Author Affiliations
Motoya Okazaki, Applied Materials (United States)
Raymond Maas, ASML Netherlands B.V. (Netherlands)
Sen-Hou Ko, Applied Materials (United States)
Yufei Chen, Applied Materials (United States)
Paul Miller, Applied Materials (United States)
Mani Thothadri, Applied Materials (United States)
Manjari Dutta, Applied Materials (United States)
Chorng-Ping Chang, Applied Materials (United States)
Abraham Anapolsky, Applied Materials (United States)
Chris Lazik, Applied Materials (United States)
Yuri Uritsky, Applied Materials (United States)
Martin Seamons, Applied Materials (United States)
Deenesh Padhi, Applied Materials (United States)
Wendy Yeh, Applied Materials (United States)
Stephan Sinkwitz, ASML Netherlands B.V. (Netherlands)
Chris Ngai, Applied Materials, Inc. (United States)

Published in SPIE Proceedings Vol. 6922:
Metrology, Inspection, and Process Control for Microlithography XXII
John A. Allgair; Christopher J. Raymond, Editor(s)

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