Share Email Print
cover

Proceedings Paper

Wafer shape compensation at the track PEB for improved CD uniformity
Author(s): Timothy Michaelson; Junyan Dai; Lu Chen; Hiram Cervera; Brian Lue; Harald Herchen; Kim Vellore; Nikolaos Bekiaris
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

This paper investigates the feasibility of using an electrostatic chuck (ESC) on a post exposure bake (PEB) plate in the track to improve the critical dimension uniformity (CDU) for bowed wafers. Although it is more conventional to consider vacuum chucking during PEB, electrostatic chucking offers some potential advantages, chief among which is the fact that electrostatic chucking does not require any type of a seal between the wafer and the PEB plate whereas vacuum chucking does. Such a seal requires contact and therefore has the potential to generate backside particles on the wafer. Electrostatic chucking therefore has the potential for a cleaner overall process. Three different PEB plates were tested in the course of this investigation, a non-chucking PEB plate (SRHP), a PEB plate equipped with a vacuum chuck (VRHP), and a PEB plate equipped with an ESC (eBHP). It was found that CD uniformities were up to 84 percent lower for bowed wafers that were chucked during PEB relative to wafers that were not chucked. In every case tested, wafers processed through chucking PEB plates showed lower CDUs than wafers processed through the non-chucking plate. CDU results were similar between vacuum chucked wafers and electrostatic chucked wafers. Based on the results presented in this paper, it can be concluded that electrostatic chucking during PEB is a feasible method for controlling CD uniformities on bowed wafers.

Paper Details

Date Published: 15 April 2008
PDF: 6 pages
Proc. SPIE 6923, Advances in Resist Materials and Processing Technology XXV, 69233M (15 April 2008); doi: 10.1117/12.772894
Show Author Affiliations
Timothy Michaelson, Sokudo USA (United States)
Junyan Dai, Sokudo USA (United States)
Lu Chen, Sokudo USA (United States)
Hiram Cervera, Sokudo USA (United States)
Brian Lue, Sokudo USA (United States)
Harald Herchen, Sokudo USA (United States)
Kim Vellore, Sokudo USA (United States)
Nikolaos Bekiaris, Sokudo USA (United States)


Published in SPIE Proceedings Vol. 6923:
Advances in Resist Materials and Processing Technology XXV
Clifford L. Henderson, Editor(s)

© SPIE. Terms of Use
Back to Top