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Proceedings Paper

Development and evaluation of 193nm immersion generation-three fluid candidates
Author(s): Paul A. Zimmerman; Jeffrey Byers; Bryan Rice; Christopher K. Ober; Emmanuel P. Giannelis; Robert Rodriguez; Dongyan Wang; Naphtali O’Connor; Xuegong Lei; Nicholas J. Turro; Vladimir Liberman; Stephen Palmacci; Mordechai Rothschild; Neal Lafferty; Bruce W. Smith
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Paper Abstract

The need to extend 193nm immersion lithography necessitates the development of a third generation (Gen-3) of high refractive index (RI) fluids that will enable approximately 1.7 numerical aperture (NA) imaging. A multi-pronged approach was taken to develop these materials. One approach investigated the highest-index organic thus far discovered. The second approach used a very high refractive index nanoparticle to make a nanocomposite fluid. This report will describe the chemistry of the best Gen-3 fluid candidates and the systematic approach to their identification and synthesis. Images obtained with the Gen-3 fluid candidates will also be presented for a NA ≥ 1.7.

Paper Details

Date Published: 15 April 2008
PDF: 10 pages
Proc. SPIE 6923, Advances in Resist Materials and Processing Technology XXV, 69230A (15 April 2008); doi: 10.1117/12.772887
Show Author Affiliations
Paul A. Zimmerman, SEMATECH (United States)
Jeffrey Byers, SEMATECH (United States)
Bryan Rice, SEMATECH (United States)
Christopher K. Ober, Cornell Univ. (United States)
Emmanuel P. Giannelis, Cornell Univ. (United States)
Robert Rodriguez, Cornell Univ. (United States)
Dongyan Wang, Cornell Univ. (United States)
Naphtali O’Connor, Columbia Univ. (United States)
Xuegong Lei, Columbia Univ. (United States)
Nicholas J. Turro, Columbia Univ. (United States)
Vladimir Liberman, MIT Lincoln Lab. (United States)
Stephen Palmacci, MIT Lincoln Lab. (United States)
Mordechai Rothschild, MIT Lincoln Lab. (United States)
Neal Lafferty, Rochester Institute of Technology (United States)
Bruce W. Smith, Rochester Institute of Technology (United States)

Published in SPIE Proceedings Vol. 6923:
Advances in Resist Materials and Processing Technology XXV
Clifford L. Henderson, Editor(s)

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