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Proceedings Paper

Interfacial adhesion studies for step and flash imprint lithography
Author(s): Michael W. Lin; Daniel J. Hellebusch; Kai Wu; Eui Kyoon Kim; Kuan Lu; Li Tao; Kenneth M. Liechti; John G. Ekerdt; Paul S. Ho; Walter Hu; C. Grant Willson
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Paper Abstract

The step and flash imprint lithography (SFIL) process requires the clean separation of a quartz template from a polymer imprint, and the force required to create this separation must be minimized to prevent the generation of defects. According to fracture mechanics principles, decreasing both the imprint polymer modulus and the interfacial fracture energy are beneficial for reducing the separation force. Adjusting the crosslinker concentration in the imprint formulation decreases the modulus but does not significantly impact the facture energy. On the other hand, fluorinated surfactant additives to the imprint fluid lower the modulus of the imprint polymer and decrease the fracture energy. The fracture energy is further decreased by using a nonreactive, liquid surfactant versus a surfactant that reacts with the polymer matrix. Angle-resolved X-ray photoelectron spectroscopy (XPS) results indicate that surfactant migration is more effective with a fluorinated surface treatment compared to an untreated quartz surface. This result shows that the use of fluorinated surfactants must be accompanied by a surface treatment that produces a similar energy or polarity to induce migration and lower the adhesive strength.

Paper Details

Date Published: 20 March 2008
PDF: 12 pages
Proc. SPIE 6921, Emerging Lithographic Technologies XII, 69210E (20 March 2008); doi: 10.1117/12.772797
Show Author Affiliations
Michael W. Lin, The Univ. of Texas at Austin (United States)
Daniel J. Hellebusch, The Univ. of Texas at Austin (United States)
Kai Wu, The Univ. of Texas at Austin (United States)
Eui Kyoon Kim, The Univ. of Texas at Austin (United States)
Kuan Lu, The Univ. of Texas at Austin (United States)
Li Tao, The Univ. of Texas at Dallas (United States)
Kenneth M. Liechti, The Univ. of Texas at Austin (United States)
John G. Ekerdt, The Univ. of Texas at Austin (United States)
Paul S. Ho, The Univ. of Texas at Austin (United States)
Walter Hu, The Univ. of Texas at Dallas (United States)
C. Grant Willson, The Univ. of Texas at Austin (United States)


Published in SPIE Proceedings Vol. 6921:
Emerging Lithographic Technologies XII
Frank M. Schellenberg, Editor(s)

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