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Proceedings Paper

Double patterning overlay and CD budget for 32 nm technology node
Author(s): Umberto Iessi; Sara Loi; Antonio Salerno; Pierluigi Rigolli; Elio De Chiara; Catia Turco; Roberto Colombo; Marco Polli; Antonio Mani
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Paper Abstract

Double patterning is the best technique which allows 193nm immersion lithography to anticipate the 32 nm node, before EUV lithography. The final device pattern is formed by two independent patterning steps where the dense pitch is doubled. This allows printing each patterning step with higher k1 imaging factor. In this paper we present the overlay and CD budget applied to a double patterning (DP) technique for the definition of a 32nm technology node device, using an immersion scanner tool. A balance among different factors which affects the final CD of the device is necessary to optimize the imaging and the alignment performances of the exposure tool. A preliminary activity is also necessary to choose the most suitable mask splitting strategy. Adopting a single mask, which is exposed twice with the appropriate shift - the final pitch - , makes the overlay between the two exposures less critical than splitting the complementary layouts on two different masks. Finally, the CD uniformity of the pooled distributions from the two exposures is evaluated in order to define the requested tool performances in terms of overlay, CD control and metrology.

Paper Details

Date Published: 7 March 2008
PDF: 10 pages
Proc. SPIE 6924, Optical Microlithography XXI, 692428 (7 March 2008); doi: 10.1117/12.772795
Show Author Affiliations
Umberto Iessi, STMicroelectronics (Italy)
Sara Loi, STMicroelectronics (Italy)
Antonio Salerno, STMicroelectronics (Italy)
Pierluigi Rigolli, STMicroelectronics (Italy)
Elio De Chiara, STMicroelectronics (Italy)
Catia Turco, STMicroelectronics (Italy)
Roberto Colombo, STMicroelectronics (Italy)
Marco Polli, KLA-Tencor Italy (Italy)
Antonio Mani, KLA-Tencor Italy (Italy)


Published in SPIE Proceedings Vol. 6924:
Optical Microlithography XXI
Harry J. Levinson; Mircea V. Dusa, Editor(s)

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