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Proceedings Paper

Dual-layer dye-filled developer-soluble BARCs for 193-nm lithography
Author(s): Jim D. Meador; Carol Beaman; Charlyn Stroud; Joyce A. Lowes; Zhimin Zhu; Douglas J. Guerrero; Ramil-Marcelo L. Mercado; David Drain
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Paper Abstract

A family of dye-filled developer-soluble bottom anti-reflective coatings (BARCs) has been developed for use in 193-nm microlithography. This new dye-filled chemical platform easily provides products covering a wide range of optical properties. The light-sensitive and positive-working BARCs use a transparent polymeric binder and a polymeric dye in a thermally crosslinking formulation, with the cured products then being photochemically decrosslinked prior to development. The cured BARC films are imaged and removed with developer in the same steps as the covering photoresist. Two dye-filled BARCs with differing optical properties were developed via a series of DOEs and then used as a dual-layer BARC stack. Lithography with this BARC stack, using a 193-nm resist, gave 150-nm L/S (1:1). A 193-nm dual-layer BARC stack (gradient optical properties) from the well-established dye-attached family of light-sensitive BARCs also gave 150-nm L/S (1:1) with the same resist. However, the latter provided much improved line shape with no scumming. The targeted application for light-sensitive dual-layer BARCs is high-numerical aperture (NA) immersion lithography where a single-layer BARC will not afford the requisite reflection control.

Paper Details

Date Published: 15 April 2008
PDF: 11 pages
Proc. SPIE 6923, Advances in Resist Materials and Processing Technology XXV, 69232W (15 April 2008); doi: 10.1117/12.772793
Show Author Affiliations
Jim D. Meador, Brewer Science, Inc. (United States)
Carol Beaman, Brewer Science, Inc. (United States)
Charlyn Stroud, Brewer Science, Inc. (United States)
Joyce A. Lowes, Brewer Science, Inc. (United States)
Zhimin Zhu, Brewer Science, Inc. (United States)
Douglas J. Guerrero, Brewer Science, Inc. (United States)
Ramil-Marcelo L. Mercado, Brewer Science, Inc. (United States)
David Drain, Missouri Univ. of Science & Technology (United States)

Published in SPIE Proceedings Vol. 6923:
Advances in Resist Materials and Processing Technology XXV
Clifford L. Henderson, Editor(s)

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