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Proceedings Paper

Projection maskless lithography (PML2): proof-of-concept setup and first experimental results
Author(s): C. Klein; E. Platzgummer; H. Loeschner; G. Gross; P. Dolezel; M. Tmej; V. Kolarik; W. Klingler; F. Letzkus; J. Butschke; M. Irmscher; M. Witt; W. Pilz
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Paper Abstract

Projection Mask-Less Lithography (PML2) is a potentially cost-effective multi electron-beam solution for the 32nm-node and beyond. PML2 is targeted on using hundreds of thousands of individually addressable electron-beams working in parallel, thereby pushing the potential throughput into the wafers per hour regime. With resolution limits <10nm, PML2 is designed to meet the requirements of several upcoming tool generations. A PML2 proof-of-concept setup was realized within the framework of the European RIMANA project. It contains all crucial components of a full-fledged PML2 tool and unambiguously demonstrates the operability of multi electron-beam projection optics with 200x reduction. In the PML2 proof-of-concept system more than 2000 switchable beams are generated by a programmable aperture plate system (APS) and projected onto wafer level with 200x demagnification. Current density (~2 A/cm2) and total current (~10 pA) of each beam are the same as in future PML2 tools, resulting in a calculated base resolution below 10nm. The PML2 proof-of-concept column has been successfully tested using resolution templates, verifying 200x reduction and the predicted 22nm hp resolution capability. Furthermore, first custom designed 32nm hp structures were printed into resist coated Si wafers using an APS test-unit. Based on the inputs obtained by the PML2 proof-of-concept system and detailed electron-optical calculations, a fully industry-compatible PML2 Alpha-tool will be realized within the European MAGIC project. Together with the infrastructure developed within MAGIC, this PML2 Alpha-tool promises to herald the introduction of mask-less lithography into the industrial environment.

Paper Details

Date Published: 20 March 2008
PDF: 8 pages
Proc. SPIE 6921, Emerging Lithographic Technologies XII, 69211O (20 March 2008); doi: 10.1117/12.772726
Show Author Affiliations
C. Klein, IMS Nanofabrication AG (Austria)
E. Platzgummer, IMS Nanofabrication AG (Austria)
H. Loeschner, IMS Nanofabrication AG (Austria)
G. Gross, IMS Nanofabrication AG (Austria)
P. Dolezel, Delong Instruments (Czech Republic)
M. Tmej, Delong Instruments (Czech Republic)
V. Kolarik, Delong Instruments (Czech Republic)
W. Klingler, Institut für Mikroelektronik Stuttgart (Germany)
F. Letzkus, Institut für Mikroelektronik Stuttgart (Germany)
J. Butschke, Institut für Mikroelektronik Stuttgart (Germany)
M. Irmscher, Institut für Mikroelektronik Stuttgart (Germany)
M. Witt, Fraunhofer Institut für Siliziumtechnologie (Germany)
W. Pilz, Fraunhofer Institut für Siliziumtechnologie (Germany)

Published in SPIE Proceedings Vol. 6921:
Emerging Lithographic Technologies XII
Frank M. Schellenberg, Editor(s)

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