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Proceedings Paper

A new robust process window qualification (PWQ) technique to perform systematic defect characterization to enlarge the lithographic process window using a die-to-database verification tool (NGR2100)
Author(s): Tadashi Kitamura; Toshiaki Hasebe; Kazufumi Kubota; Futoshi Sakai; Shinichi Nakazawa; Michael Hoffman; Masahiro Yamamoto; Masahiro Inoue
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Paper Abstract

A new Robust Process Window Qualification (PWQ) Technique to perform systematic defect characterization to enlarge the Lithographic process window is described, using a Die-to-Database Verification Tool (NGR2100).

Paper Details

Date Published: 1 April 2008
PDF: 5 pages
Proc. SPIE 6925, Design for Manufacturability through Design-Process Integration II, 692519 (1 April 2008); doi: 10.1117/12.772706
Show Author Affiliations
Tadashi Kitamura, NanoGeometry Research, Inc. (Japan)
Toshiaki Hasebe, NanoGeometry Research, Inc. (Japan)
Kazufumi Kubota, NanoGeometry Research, Inc. (Japan)
Futoshi Sakai, NanoGeometry Research, Inc. (Japan)
Shinichi Nakazawa, NanoGeometry Research, Inc. (Japan)
Michael Hoffman, NanoGeometry Research, Inc. (Japan)
Masahiro Yamamoto, NanoGeometry Research, Inc. (Japan)
Masahiro Inoue, Topcon Corp. (Japan)


Published in SPIE Proceedings Vol. 6925:
Design for Manufacturability through Design-Process Integration II
Vivek K. Singh; Michael L. Rieger, Editor(s)

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