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Proceedings Paper

Etching spin-on trilayer masks
Author(s): David J. Abdallah; Shinji Miyazaki; Aritaka Hishida; Allen Timko; Douglas McKenzie; Dalil Rahman; WooKyu Kim; Lyudmila Pylneva; Hengpeng Wu; Ruzhi Zhang; Ping-Hung Lu; Mark Neisser; Ralph Dammel
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Paper Abstract

Spin-on trilayer materials are increasingly being integrated in high density microfabrication that use high NA ArF lithography due to dwindling photoresist film thicknesses, lower integration cost and reduced complexity compared to analogous CVD stacks. To guide our development in spin-on trilayer materials we have established etch conditions on an ISM etcher for pattern transfer through trilayer hard masks. We report here a range of etch process variables and their impact on after-etch profiles and etch selectivity with AZ trilayer hard mask materials. Trilayer pattern transfer is demonstrated using 1st and 2nd minimum stacks with various pattern types. Etch recipes are then applied to blanket coated wafers to make comparisons between etch selectivities derived from patterned and blanket coated wafers.

Paper Details

Date Published: 15 April 2008
PDF: 8 pages
Proc. SPIE 6923, Advances in Resist Materials and Processing Technology XXV, 69230U (15 April 2008); doi: 10.1117/12.772691
Show Author Affiliations
David J. Abdallah, AZ Electronic Materials (United States)
AZ Electronic Materials (Japan)
Shinji Miyazaki, AZ Electronic Materials (United States)
AZ Electronic Materials (Japan)
Aritaka Hishida, AZ Electronic Materials (United States)
AZ Electronic Materials (Japan)
Allen Timko, AZ Electronic Materials (United States)
AZ Electronic Materials (Japan)
Douglas McKenzie, AZ Electronic Materials (United States)
AZ Electronic Materials (Japan)
Dalil Rahman, AZ Electronic Materials (United States)
AZ Electronic Materials (Japan)
WooKyu Kim, AZ Electronic Materials (United States)
AZ Electronic Materials (Japan)
Lyudmila Pylneva, AZ Electronic Materials (United States)
AZ Electronic Materials (Japan)
Hengpeng Wu, AZ Electronic Materials (United States)
AZ Electronic Materials (Japan)
Ruzhi Zhang, AZ Electronic Materials (United States)
AZ Electronic Materials (Japan)
Ping-Hung Lu, AZ Electronic Materials (United States)
AZ Electronic Materials (Japan)
Mark Neisser, AZ Electronic Materials (United States)
AZ Electronic Materials (Japan)
Ralph Dammel, AZ Electronic Materials (United States)
AZ Electronic Materials (Japan)


Published in SPIE Proceedings Vol. 6923:
Advances in Resist Materials and Processing Technology XXV
Clifford L. Henderson, Editor(s)

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