Share Email Print
cover

Proceedings Paper

Progress in extreme ultraviolet interferometric lithography at the University of Wisconsin
Author(s): Artak Isoyan; Yang-Chun Cheng; Fan Jiang; John Wallace; Mikhail Efremov; Paul Nealey; Franco Cerrina
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Extreme Ultraviolet Interferometric lithography (EUV-IL) can generate periodic patterns useful to characterize photoresist materials and to create templates for self-assembled geometries. The Center for NanoTechnology has developed a novel EUV-IL beamline dedicated to nanopatterning using radiation from an undulator on the Aladdin storage ring at the University of Wisconsin-Madison. The beamline and the EUV-IL system were commissioned in 2006; we have completed several characterization studies, and modified several key components to improve resolution and usability. The EUV-IL system can expose different pitches at the same time producing patterns with a range of halfpitch from 55nm down to 20nm and less on the wafer. We can also introduce a variable image modulation by performing double exposures, overlapping the interference pattern with the transmitted zero order. Recently we have demonstrated down to 20nm half-pitch printed IL image in PMMA resist.

Paper Details

Date Published: 21 March 2008
PDF: 6 pages
Proc. SPIE 6921, Emerging Lithographic Technologies XII, 69212R (21 March 2008); doi: 10.1117/12.772681
Show Author Affiliations
Artak Isoyan, Univ. of Wisconsin, Madison (United States)
Yang-Chun Cheng, Univ. of Wisconsin, Madison (United States)
Fan Jiang, Univ. of Wisconsin, Madison (United States)
John Wallace, Univ. of Wisconsin, Madison (United States)
Mikhail Efremov, Univ. of Wisconsin, Madison (United States)
Paul Nealey, Univ. of Wisconsin, Madison (United States)
Franco Cerrina, Univ. of Wisconsin, Madison (United States)


Published in SPIE Proceedings Vol. 6921:
Emerging Lithographic Technologies XII
Frank M. Schellenberg, Editor(s)

© SPIE. Terms of Use
Back to Top