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Proceedings Paper

Paving the way for multiple applications for the 3D-AFM technique in the semiconductor industry
Author(s): J. Foucher; E. Pargon; M. Martin; S. Reyne; C. Dupré
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Paper Abstract

The 3D-AFM technique is a very well known technique as a non destructive reference to calibrate CD-SEM and Scatterometry metrology. However, recent hardware, tip design and tip treatment improvements have offered to the technique new capabilities that pave the way for multiple applications in the semiconductor industry. The 3D-AFM technique is today not only a calibrating technique but also a process control technique that can be use either at the R&D level or in fab environment. In this paper, we will address the limits of the 3D-AFM technique for the semiconductor industry depending on the applications by focusing our study on tip to sample interactions. We will identify, test and validate potential industrial solutions that could extend the 3D-AFM potentialities. Subsequently, we will show some interesting applications of the technique related to LER/LWR transfer during silicon gate patterning and related to advance multiwires devices fabrication.

Paper Details

Date Published: 3 April 2008
PDF: 9 pages
Proc. SPIE 6922, Metrology, Inspection, and Process Control for Microlithography XXII, 69220F (3 April 2008); doi: 10.1117/12.772675
Show Author Affiliations
J. Foucher, CEA-LETI-MINATEC (France)
E. Pargon, LTM (France)
M. Martin, LTM (France)
S. Reyne, CEA-LETI-MINATEC (France)
C. Dupré, CEA-LETI-MINATEC (France)
IMEP-LAHC, INPG-MINATEC (France)


Published in SPIE Proceedings Vol. 6922:
Metrology, Inspection, and Process Control for Microlithography XXII
John A. Allgair; Christopher J. Raymond, Editor(s)

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