Share Email Print

Proceedings Paper

New architectures for high resolution patterning
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

The ability of the semiconductor industry to reduce device dimensions below 45 nm is hindered by limitations in both resist material and processing techniques. High resolution and sensitivity along with low line edge roughness are key requirements of next generation resist materials. In order to meet future demands of the semiconductor industry, new resist design strategies are being considered. In the past few years, we have focused on developing small molecule resists capable of high resolution patterning. Despite their small size, these molecules known as molecular glasses can be designed to demonstrate high glass transition temperature (Tg) comparable to polymeric resists. Several ring and branched architectures with high Tg values that have attained feature resolution as small as 30nm through Extreme Ultraviolet (EUV) exposure will be discussed. In addition to potential performance advantages, the small size of these resist molecules also allows solvent free processing techniques to be utilized. Our efforts on physical vapor deposition and supercritical CO2 development of molecular glass resists will also be highlighted. Furthermore, we are also investigating hybrid resist materials by combining short polymeric arms with various molecular glass cores. These innovative architectures are being explored at 193nm wavelength through fundamental structure - property analysis.

Paper Details

Date Published: 26 March 2008
PDF: 9 pages
Proc. SPIE 6923, Advances in Resist Materials and Processing Technology XXV, 69230O (26 March 2008); doi: 10.1117/12.772667
Show Author Affiliations
Anuja De Silva, Cornell Univ. (United States)
Nelson Felix, Cornell Univ. (United States)
Drew Forman, Cornell Univ. (United States)
Jing Sha, Cornell Univ. (United States)
Christopher K. Ober, Cornell Univ. (United States)

Published in SPIE Proceedings Vol. 6923:
Advances in Resist Materials and Processing Technology XXV
Clifford L. Henderson, Editor(s)

© SPIE. Terms of Use
Back to Top