Share Email Print
cover

Proceedings Paper

Achieving small dimensions with an environmentally friendly solvent: photoresist development using supercritical CO2
Author(s): Nelson M. Felix; Anuja De Silva; Jing Sha; Christopher K. Ober
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Details

Date Published: 4 April 2008
PDF: 11 pages
Proc. SPIE 6923, Advances in Resist Materials and Processing Technology XXV, 69233L (4 April 2008); doi: 10.1117/12.772635
Show Author Affiliations
Nelson M. Felix, Cornell Univ. (United States)
Anuja De Silva, Cornell Univ. (United States)
Jing Sha, Cornell Univ. (United States)
Christopher K. Ober, Cornell Univ. (United States)


Published in SPIE Proceedings Vol. 6923:
Advances in Resist Materials and Processing Technology XXV
Clifford L. Henderson, Editor(s)

© SPIE. Terms of Use
Back to Top