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Proceedings Paper

Hot spot management with die-to-database wafer inspection system
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Paper Abstract

We constructed hot spot management flow with a die-to-database inspection system that is required for both hot spot extraction accuracy and short development turn-around-time (TAT) in low k1 lithography. The die-to-database inspection system, NGR-2100, has remarkable features for the full chip inspection within reasonable operating time. The system provided higher hot spot extraction accuracy than the conventional optical inspection tool. Also, hot spots extracted by the system could cover all killer hot spots extracted by electrical and physical analysis. In addition, the new hot spot extraction methodology employing the die-to-database inspection system is highly advantageous in that it shortens development TAT by two to four months. In the application to 65nm node CMOS, we verified yield improvement with the new hot spot management flow. Also, the die-to-database inspection system demonstrated excellent interlayer hot spot extraction from the viewpoint of LSI fabrication.

Paper Details

Date Published: 19 March 2008
PDF: 8 pages
Proc. SPIE 6925, Design for Manufacturability through Design-Process Integration II, 692517 (19 March 2008); doi: 10.1117/12.772563
Show Author Affiliations
Kohji Hashimoto, Toshiba Corp. (Japan)
Satoshi Usui, Toshiba Corp. (Japan)
Kenji Yoshida, Toshiba Corp. (Japan)
Ichirota Nagahama, Toshiba Corp. (Japan)
Osamu Nagano, Toshiba Corp. (Japan)
Yasuo Matsuoka, Toshiba Corp. (Japan)
Yuuichiro Yamazaki, Toshiba Corp. (Japan)
Soichi Inoue, Toshiba Corp. (Japan)

Published in SPIE Proceedings Vol. 6925:
Design for Manufacturability through Design-Process Integration II
Vivek K. Singh; Michael L. Rieger, Editor(s)

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